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Sometimes, networking professionals looks flooded with high-speed assembly terminologies such as; Interoperability, DAC, QSFP+, SFP+, EEPROM, AOC, QSFP, SFF, etc. High-Speed assemblies are considered ideal in numerous data center deployment scenarios including but not limited to Middle of Row (MoR) and Top of Rack (ToR). It is a matter of the fact that new technologies and products are getting launched at an astonishing rate. Today, we are going to present our readers with a comprehensive list of various assembly terms and their acronyms. So, this article can prove to be a good reference point for many. Following are some phrases that are commonly used in connection to high-speed assemblies.

In diesem Artikel soll es um einige wichtige Faktoren gehen, die es beim Planen und Ausführen von Wartungen an Ihrem Rechenzentrum zu beachten gibt. Es sei darauf hingewiesen, dass die folgenden Richtlinien allgemeiner Art sind und sich auf die meisten Rechenzentren beziehen ohne Bezug zur Größe der Anlage oder der verwendeten Technologien.

Generally speaking, a Layer 2 switch is all that you need to interconnect all client devices and network devices in a LAN. The primary function of a Layer 2 switch is to direct traffic coming from devices within a Local Area Network (LAN). A Layer 2 switch operates with MAC addresses to determine the path through which data packets are to be delivered. Layer 2 switches are not designed for routing, and thus you cannot connect to the internet through these switches. The diagram below is showing a basic Local Area Network with multiple Layer 2 switches and one router (Layer 3) device involved;